The United States Patent Trial and Appeal Board has denied the institution of Inter Partes Review (IPR) IPR2022-01083 on December 6, 2022. Globalfoundries (GF), a multinational semiconductor contract manufacturing and design company, has filed the IPR seeking to invalidate US Patent 7,402,903 B2. The patent relates to state-of-the-art design and manufacturing of Through Silicon Vias (TSVs) found in semiconductor devices, a feature essential to the stacking of microchips. The PTAB decision can be found here.
Previously, The United States Patent Trial and Appeal Board has denied the institution of Inter Partes Review (IPR) IPR2022-00763 related to US Patent 6,291,861 B1 on October 7, 2022. The patent relates to state-of-the-art design and manufacturing of semiconductor devices such as FinFet Transistors.
On February 24, 2022, Katana Silicon Technologies LLC (KST) has filed a patent infringement complaint in the US District Court for the Western District of Texas against Globalfoundries. The case number is 6:22-cv-00191. The patents at issue are US Patent 6,291,861 B1 and US Patent 7,402,903 B2.
KST has acquired several portfolios of patents from a plurality of world-leading semiconductor companies such as Samsung Electronics, Toshiba, UMC and Sharp.