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Mago Barca IP Files Patent Infringement Lawsuit Against SK hynix, Asserting Advanced Semiconductor and Packaging Innovations

Writer: LONGHORN IP
LONGHORN IP
11 minutes ago
2 min read

Plano, Texas – October 9, 2026 – Mago Barca IP LLC today announced the filing of a patent infringement lawsuit against SK hynix Inc. in the United States District Court for the Eastern District of Texas. The Case Number is 2:26-cv-00916, filed in the United States District Court for the Eastern District of Texas, Marshall Division. The complaint asserts five U.S. patents covering foundational semiconductor manufacturing, through-silicon via (TSV) technology, advanced packaging, stacked-die architectures, and memory fabrication innovations allegedly used in SK hynix HBM and DDR memory products.


The lawsuit alleges infringement of U.S. Patent Nos. 9,177,914, 9,530,690, 9,984,971, 11,410,877, and 8,334,170, and identifies SK hynix HBM3 and DDR4 memory products among the accused technologies. According to the complaint, the asserted patents relate to semiconductor structures and manufacturing processes developed by inventors affiliated with Taiwan Semiconductor Manufacturing Company (TSMC), the global leader in semiconductor manufacturing and advanced packaging technologies.


 The complaint includes reverse-engineering evidence and technical analysis that demonstrates the presence of patented TSV structures, metal-pad architectures, stacked-die configurations, and source/drain contact technologies within accused SK hynix products.


“Mago Barca is committed to protecting high-value semiconductor innovations that originated from some of the industry's most important technology development efforts,” said Khaled Fekih-Romdhane, Manager of Mago Barca IP LLC. “These patents reflect pioneering work by inventors associated with TSMC, whose contributions have helped shape modern semiconductor manufacturing and advanced packaging technologies used throughout the global electronics industry.”


According to the complaint, the asserted patent portfolio addresses critical technologies used in modern high-performance semiconductors, including:


  • Through-silicon via (TSV) interconnect structures for advanced chip stacking.

  • Metal-pad architectures designed to reduce shorting and improve reliability in advanced semiconductor devices.

  • Methods for fabricating stacked semiconductor devices used in high-bandwidth memory products.

  • Source/drain contact structures utilized in advanced memory manufacturing.


The complaint further alleges that SK hynix received notices regarding the asserted patents beginning in June 2025 and subsequently engaged in technical and licensing discussions with Mago Barca before the filing of the lawsuit. The complaint seeks damages for patent infringement, enhanced damages for alleged willful infringement, attorneys' fees, and other relief available under U.S. patent law.


The case highlights the growing strategic importance of intellectual property surrounding advanced packaging and stacked memory technologies that have become essential for artificial intelligence accelerators, high-performance computing systems, and next-generation data center infrastructure. SK hynix has publicly promoted its HBM products as memory solutions for AI, supercomputing, and data center applications.


As AI-driven demand accelerates globally, technologies related to TSVs, die stacking, packaging integration, and semiconductor process innovations have become among the most valuable assets in the semiconductor industry. The patents asserted by Mago Barca represent innovations that originated from inventors affiliated with TSMC, a company widely recognized as the world leader in advanced semiconductor manufacturing and packaging technologies.

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About Mago Barca IP LLC

Mago Barca IP LLC is a Texas-based intellectual property company focused on the licensing, protection, and enforcement of innovative semiconductor technologies. The company owns patents covering advanced semiconductor structures, fabrication processes, packaging technologies, and memory-device innovations developed by leading industry inventors and research teams.


Media Contact

Mago Barca IP LLC

8150 Rasor Boulevard, Suite 210

Plano, TX 75024














 
 
 

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